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Power Semiconductors

Hitachi

Q1.What issues should be considered in designing an Inverter printed circuit board?

An inverter outputs the voltage of a rectangular waveform with the amplitude of high-voltage power supply voltage and a ground level. The voltage increase rate (dv/dt) level is very high in several 100v/microsecond - several 1000v/[ microsecond and ]. On the other hand, the wiring treating the about [ 5V ] voltage of a low level, such as a Hall signal (HU, HV, HW terminal), and a speed instruction signal (VSP terminal), a triangular wave signal (CR terminal), exists on the same board. These low-voltage wiring systems and an output wiring system may carry out capacity combination through the floating capacity of a substrate etc., and a noise may occur in a low-voltage wiring system by dv/dt of an output. Please arrange a pattern so that bad influences, such as floating capacity of a substrate, do not come out if possible. Moreover, it also becomes a means effective in the measure against a noise to add a capacitor, pull-up resistance, etc. and to attain low impedance of a wiring system. Next, into the portion by which large current, such as an inverter output terminal, and a power supply, ground wiring, flows, please arrange a pattern so that an inductance does not occur if possible. The noise may occur in a power supply system or a ground wiring system, and over voltage may be applied to IC. In this case, since it leads to IC destruction, we ask sufficient consideration of you.

Q2.What can be done in cases where standards for pin insulation distance cannot be met?

We recommend giving coating processing or mold to the pin of IC. There are various kind of coating resin. There is unknown point that the influence from a size of a substrate, and thickness, in addition parts etc, add the thermal and mechanical stress to a semiconductor device. Therefore, in selection of coating resin, we ask of you so that consultation may upper-use it with a substrate maker.

Q3.What issues should be considered when mounting an Inverter IC inside a motor?

Especially the point which it should be careful of an insulation voltage test of a motor. Generally in an insulation voltage test of a motor, the voltage of several 1000 V is applied. On the other hand, since the maximum rating of inverter IC is about 500V even if it is high, when an insulated design is inadequate, over voltage is applied to IC and IC may be destroyed. Moreover, the tab (cooling fin) and IC chip are connected to GL terminal by the high resistance about several 100 k-ohms, and insulation is not carried out. Therefore, when attaching a tab in a motor case, on both sides of an insulated sheet etc., it is necessary to take insulation.

Q4.How should I insulate the tab(cooling fin) of an inverter IC from an external fin?

The tab (cooling fin) and IC chip of inverter IC are connected to GL terminal by the high resistance about several 100 k-ohms, and insulation is not carried out. Therefore, when insulating IC tab and an external fin, on both sides of an insulated sheet etc., it is necessary to take insulation.

Q5.Should I connect the tab (cooling fin) of an inverter IC to Ground or let it float?

The tab of inverter IC does not need to fix potential electrically. However, if potential is fixed to the ground of IC etc., the floating capacity inside IC may become large, and incorrect operation may be caused. Therefore, we recommend you that it is not made to have potential fixed.

Q6.Are there any precautions for connecting Inverters to External Power Devices?

If wiring is long, a noise and over voltage will become that it is easy to be applied to IC. At this time, IC may incorrect-operate by the noise or may be destroyed by the over voltage. Cautions are required in acting as the monitor of each terminal and over voltage not being applied to IC. In addition, this IC has not guaranteed the amount of surge voltage durability. if the maximum rating voltage is exceeded, there is a possibility of causing degradation of IC and destruction.