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Micro Device Division

Hitachi

Products

High-Speed highly-integrated LSI

High-Speed highly integrated LSI
CMOS ASIC Cmos Asic CMOS ASICs for high-speed operation and in packages with large numbers of pins
IP Core IP Core IP cores for realizing high-performance CMOS ASICs
PHY (PCIe / DDR3) : PCI Express Gen1/Gen2 and DDR3 SDRAM with built-in self-test functions
SerDes I/O PLL : Supporting various interface standards
High-speed memory (RAM / CAM) : High-speed SRAM macro, Ternary CAM macro
High-speed memory embedded LSI High-Speed Memory Consolidation LSI High-speed cache memory, Graphics memory, Network memory

Mixed-signal / High-voltage LSI

Mixed-signal / High-voltage LSI
IC for 10-Gbps optical transmission systems 10Gbps Ultra-High-Speed IC Low-noise, highly sensitive transimpedance amplifiers (TIAs) Automatic gain control amplifier (AGC)
D/A Converter DA Converter High precision 14-bit multi-channel D/A converter
IC for medical ultrasound imaging applications IC for medical treatment 8-channel +/-100V /2.5A fully-integrated ultrasound pulser IC

Foundry & Package

Foundry & Package
SiGe BiCMOS foundry service Si foundry service SiGe BiCMOS shuttle trial and foundry service.
Package information Package information High-speed, high pin-count (over 2000) and other packages
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PCI Express(R) is a trademark or registered trademark of PCI-SIG Corporation in the United States and other countries.
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All other company names and product names in this website are trademarks or registered trademarks of the respective companies.