| CMOS ASIC | ![]() |
CMOS ASICs for high-speed operation and in packages with large numbers of pins |
|---|---|---|
| IP Core | IP cores for realizing high-performance CMOS ASICs | |
| PHY (PCIe / DDR3) : PCI Express Gen1/Gen2 and DDR3 SDRAM with built-in self-test functions | ||
| SerDes I/O PLL : Supporting various interface standards | ||
| High-speed memory (RAM / CAM) : High-speed SRAM macro, Ternary CAM macro | ||
| High-speed memory embedded LSI | ![]() |
High-speed cache memory, Graphics memory, Network memory |
| IC for 10-Gbps optical transmission systems | ![]() |
Low-noise, highly sensitive transimpedance amplifiers (TIAs) Automatic gain control amplifier (AGC) |
|---|---|---|
| D/A Converter | ![]() |
High precision 14-bit multi-channel D/A converter |
| IC for medical ultrasound imaging applications | ![]() |
8-channel +/-100V /2.5A fully-integrated ultrasound pulser IC |
| SiGe BiCMOS foundry service | ![]() |
SiGe BiCMOS shuttle trial and foundry service. |
|---|---|---|
| Package information | ![]() |
High-speed, high pin-count (over 2000) and other packages |